Master thesis: Structural optimization of electronic packages using DOE (Design Of Experiments)
Place of action:
The thesis work will be conducted at the section of Environmental Analysis at SAAB Surveillance in Gothenburg with support from the section of Microwave and Antenna Design. The section of Environmental Analysis is responsible for environmental engineering analysis within structural analysis, thermal analysis and material analysis. Our mission is to ensure safe and reliable products regarding electronics, mechanics and system structures. The section is involved from early concept design through defining necessary requirements, perform detail design and structural analysis and finally verify the final product. The section is involved in all types of radar products design by SAAB Surveillance and work with design of systems such as Gripen, GlobalEye and Giraffe AMB.
Your future challenge:
We strive towards maximizing the performance of our products and combined with hard environmental demands does this mean that we are at the edge of what the materials and designs may handle without failure. This means that a thorough design work is performed to make sure the products can withstand the loads of which it is subjected. One important tool in the design phase is structural optimization of systems.
Optimization of a complex system is very time consuming due to large amount of parameters (or design variables). Design of Experiments (DOE) can be used for parameter screening to determine which factors are most influential to the design goals. The initial screening will discard parameters which do not influence the system, hence reduce the number of parameters and calculation times. A detailed study using DOE will obtain important information of the structure’s behavior for the proposed parameter sets and map the structural identity of the system and how it varies with the parameters.
The reliability of the electronic package is essential for the reliability of the radar systems. One of the main challenges for the reliability of the electronic package is the thermal stress due to different coefficient of thermal expansion (CTE) between different materials during temperature cycling. The built up of an electronic package contains of many different materials with various geometries, which results in many parameters during design phases.
Finite element method (FEM) has been used for the estimation of fatigue life of electronic packages with solder joints. Normally models with fine meshes are needed, which is resulting in large model with long simulation time. Hence an initial parameter screening will make the analysis much more effective, which in turn gives an optimal design.
This thesis work is a continued study of the method DOE using HyperStudy. Previously performed master theses in spring 2018 and 2019 have evaluated the theoretical models for design of experiments (DOE), performed parameter screening and applied it on a purely mechanical system. This thesis will apply DOE on electronic packages in order to map the structural identity and contribute to an improved understanding of the structural behavior and in the long run contribute to improved designs.
You are probably studying mechanical engineering, applied physics or equivalent. The work will include finite element analysis (FEM) so knowledge within this is a merit. Two students working together with the thesis is recommended but not a requirement.
Last updated: 19 November 2019 • 17:39